NettetJoint University Microelectronics Program 2.0 JUMP 2.0, a consortium of industrial participants in cooperation with the Defense Advanced Research Projects Agency, … Nettet6. apr. 2024 · Boise State University has joined a nationwide program worth $34 million to accelerate innovation and the creation of new approaches in microelectronics. Led by the Semiconductor Research Corporation, the Joint University Microelectronics (JUMP) 2.0 program aims to develop energy-efficient semiconductor materials and technologies.
SRC Launches JUMP 2.0 Consortium Aimed at Leap-Ahead Microelectronics …
Nettet22. des. 2024 · [email protected]. 12/22/2024. DARPA today announced its participation in a new long-term university research collaboration with the … Nettet27. feb. 2024 · The project was created by the Joint University Microelectronics Program 2.0 (JUMP 2.0) Rice University is one of 14 university partners named to the … proliance mickelson
Purdue Engineering to play key role in two new SRC JUMP 2.0 …
Nettet13. des. 2024 · JUMP 2.0 will drive long-term pathfinding university research that substantially increases the performance, efficiency, and capabilities of broad classes of … Nettet9. jan. 2024 · Jan. 9, 2024 — SRC, along with the Defense Advanced Research Projects Agency and industry and academic stakeholders, is kicking off the Joint University Microelectronics Program 2.0 (JUMP 2.0).The SRC-led effort expands on the original JUMP collaboration aimed at accelerating U.S. advances in information and … Nettet6. feb. 2024 · The Joint University Microelectronics Program 2.0 (JUMP 2.0) is a public-private partnership co-sponsored by the SRC, DARPA, the commercial semiconductor industry and the defense industrial base. JUMP 2.0 will pursue high-risk, high-payoff research spanning seven thematically structured centers. label cherry red records